{"id":3019,"date":"2022-02-25T13:10:34","date_gmt":"2022-02-25T12:10:34","guid":{"rendered":"https:\/\/silentdynamics.de\/?p=3019"},"modified":"2022-02-25T13:46:13","modified_gmt":"2022-02-25T12:46:13","slug":"elektronik-kuehlung-simulation","status":"publish","type":"post","link":"https:\/\/silentdynamics.de\/fr\/2022\/02\/25\/elektronik-kuehlung-simulation\/","title":{"rendered":"Simulation de refroidissement \u00e9lectronique avec OpenFOAM"},"content":{"rendered":"<p>L'espace limit\u00e9 et la consommation d'\u00e9nergie \u00e9lev\u00e9e conduisent finalement \u00e0 une conception de refroidissement innovante pour une large gamme de circuits imprim\u00e9s. L'arrangement des alimentations, les dimensions des dissipateurs thermiques et la conception du bo\u00eetier ext\u00e9rieur prennent de l'importance. Les simulations thermiques pendant le processus de conception des circuits imprim\u00e9s aident \u00e0 \u00e9viter les probl\u00e8mes de surchauffe dans les phases de production ult\u00e9rieures.&nbsp;<\/p>\n\n\n\n<p>Des mat\u00e9riaux diff\u00e9rents, combinant conduction thermique, convection et rayonnement dans les solides et l'air, entra\u00eenent une simulation thermique assez complexe. La configuration des propri\u00e9t\u00e9s des mat\u00e9riaux, des conditions aux limites, des param\u00e8tres du solveur et des zones de couplage prend souvent un temps consid\u00e9rable.<\/p>\n\n\n\n<p>\u00c0 titre d'exemple, une carte de circuit imprim\u00e9 typique avec ses composants est pr\u00e9sent\u00e9e.<\/p>\n\n\n\n<figure class=\"wp-block-gallery has-nested-images columns-default is-cropped wp-block-gallery-1 is-layout-flex wp-block-gallery-is-layout-flex\">\n<figure class=\"wp-block-image size-large is-resized is-style-default\"><a href=\"https:\/\/silentdynamics.de\/wp-content\/uploads\/2022\/01\/plate.png\"><img loading=\"lazy\" decoding=\"async\" data-id=\"2996\" src=\"https:\/\/silentdynamics.de\/wp-content\/uploads\/2022\/01\/plate-1024x644.png\" alt=\"\" class=\"wp-image-2996\" width=\"411\" height=\"258\" srcset=\"https:\/\/silentdynamics.de\/wp-content\/uploads\/2022\/01\/plate-1024x644.png 1024w, https:\/\/silentdynamics.de\/wp-content\/uploads\/2022\/01\/plate-300x189.png 300w, https:\/\/silentdynamics.de\/wp-content\/uploads\/2022\/01\/plate-768x483.png 768w, https:\/\/silentdynamics.de\/wp-content\/uploads\/2022\/01\/plate.png 1230w\" sizes=\"auto, (max-width: 411px) 100vw, 411px\" \/><\/a><\/figure>\n<\/figure>\n\n\n\n<p><strong>Simulation thermique<\/strong>&nbsp;<\/p>\n\n\n\n<p>Silentdynamics a r\u00e9ussi \u00e0 configurer la simulation en utilisant les solveurs thermiques OpenFOAM (<em>chtMultiRegionFoam<\/em>, <em>chtMultiRegionSimpleFoam<\/em>) au sein du framework InsightCAE pour un pr\u00e9traitement rapide.<\/p>\n\n\n\n<p>L'importation de fichiers CAO pour chaque composant et le processus optimis\u00e9 de maillage parall\u00e8le des r\u00e9gions avec <em>snappyHexMesh<\/em> sont essentiels pour le couplage thermique conservateur des diff\u00e9rentes r\u00e9gions.<\/p>\n\n\n\n<div class=\"wp-block-image\"><figure class=\"aligncenter size-large is-resized\"><a href=\"https:\/\/silentdynamics.de\/wp-content\/uploads\/2022\/01\/mesh.png\"><img loading=\"lazy\" decoding=\"async\" src=\"https:\/\/silentdynamics.de\/wp-content\/uploads\/2022\/01\/mesh-1024x722.png\" alt=\"\" class=\"wp-image-2998\" width=\"433\" height=\"305\" srcset=\"https:\/\/silentdynamics.de\/wp-content\/uploads\/2022\/01\/mesh-1024x722.png 1024w, https:\/\/silentdynamics.de\/wp-content\/uploads\/2022\/01\/mesh-300x212.png 300w, https:\/\/silentdynamics.de\/wp-content\/uploads\/2022\/01\/mesh-768x541.png 768w, https:\/\/silentdynamics.de\/wp-content\/uploads\/2022\/01\/mesh.png 1200w\" sizes=\"auto, (max-width: 433px) 100vw, 433px\" \/><\/a><\/figure><\/div>\n\n\n\n<p>Veuillez noter que l'utilisation de diff\u00e9rentes vias, de fils de cuivre, de couches de transfert thermique ou d'autres points li\u00e9s \u00e0 la chaleur doit \u00eatre prise en compte dans le mod\u00e8le de simulation. \u00c0 l'aide de la mod\u00e9lisation par r\u00e9gions, des CellSets et de la d\u00e9finition des couches pour chaque composant, toutes les propri\u00e9t\u00e9s thermiques requises peuvent \u00eatre prises en compte.<\/p>\n\n\n\n<p>Gr\u00e2ce \u00e0 la possibilit\u00e9 de d\u00e9finir des marqueurs sp\u00e9ciaux, la construction de la simulation CHT est pratiquement automatis\u00e9e.&nbsp;<\/p>\n\n\n\n<p>En outre, un traitement am\u00e9lior\u00e9 du rayonnement thermique et des r\u00e9glages de solveur optimis\u00e9s constituent la base de simulations stables et convergentes.&nbsp;<\/p>\n\n\n\n<div class=\"wp-block-image\"><figure class=\"aligncenter size-large is-resized\"><a href=\"https:\/\/silentdynamics.de\/wp-content\/uploads\/2022\/01\/plate1.png\"><img loading=\"lazy\" decoding=\"async\" src=\"https:\/\/silentdynamics.de\/wp-content\/uploads\/2022\/01\/plate1-1024x703.png\" alt=\"\" class=\"wp-image-2997\" width=\"417\" height=\"284\"\/><\/a><\/figure><\/div>","protected":false},"excerpt":{"rendered":"<p>Der begrenzte Platz und die hohe Leistungsaufnahme f\u00fchren schlie\u00dflich zu einem innovativen K\u00fchlungsdesign f\u00fcr eine breite Palette von Leiterplatten. Die Anordnung der Stromversorgungen, die Abmessungen der K\u00fchlk\u00f6rper und das Design des Au\u00dfengeh\u00e4uses gewinnen an Bedeutung. Thermische Simulationen w\u00e4hrend des Entwurfsprozesses von Leiterplatten helfen, \u00dcberhitzungsprobleme in der sp\u00e4teren Produktionsphase zu vermeiden.&nbsp; Unterschiedliche Materialien, die Kombination von [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":2996,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[951],"tags":[],"class_list":["post-3019","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-simulation"],"_links":{"self":[{"href":"https:\/\/silentdynamics.de\/fr\/wp-json\/wp\/v2\/posts\/3019","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/silentdynamics.de\/fr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/silentdynamics.de\/fr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/silentdynamics.de\/fr\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/silentdynamics.de\/fr\/wp-json\/wp\/v2\/comments?post=3019"}],"version-history":[{"count":0,"href":"https:\/\/silentdynamics.de\/fr\/wp-json\/wp\/v2\/posts\/3019\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/silentdynamics.de\/fr\/wp-json\/wp\/v2\/media\/2996"}],"wp:attachment":[{"href":"https:\/\/silentdynamics.de\/fr\/wp-json\/wp\/v2\/media?parent=3019"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/silentdynamics.de\/fr\/wp-json\/wp\/v2\/categories?post=3019"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/silentdynamics.de\/fr\/wp-json\/wp\/v2\/tags?post=3019"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}